@inproceedings{stoumpos:hal-04222949,
TITLE = {Orthomode Transducers in Additive Manufacturing for Broadband and High-Power Applications},
AUTHOR = {Stoumpos, C. and Duran-Venegas, J-A and Pierr{\'e},
T and Garc{\'i}a-Vigueras, M.},
URL = {https://hal.science/hal-04222949},
BOOK
TITLE = {17th European Conference on Antennas and Propagation (EuCAP)},
ADDRESS = {Florence, Italy},
PUBLISHER = {IEEE},
SERIES = {2023 17TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION, EUCAP},
YEAR = {2023},
MONTH = Mar, DOI = {10.23919/EuCAP57121.2023.10132846},
KEYWORDS = {Additive manufacturing ; Boifot junction ; Multipactor ; orthomode transducer ; Secondary Emission Yield (SEY) ; Selective Laser Melting (SLM) ; turnstile junction},
HAL_ID = {hal-04222949},
HAL_VERSION = {v1},
}