@article{alves:hal-03030289,
TITLE = {Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs},
AUTHOR = {Alves, Luciano F S and Lefranc, Pierre and Jeannin, Pierre-Olivier and Sarrazin, Benoit and Crebier, Jean-Christophe},
URL = {https://hal.science/hal-03030289},
JOURNAL = {Electronics},
PUBLISHER = {MDPI},
VOLUME = {9},
NUMBER = {9},
PAGES = {1341},
YEAR = {2020},
MONTH = Sep, DOI = {10.3390/electronics9091341},
KEYWORDS = {series connection ; SiC-MOSFETs ; packaging},
PDF = {https://hal.science/hal-03030289/file/MDPI2020MultiSTEP.pdf},
HAL_ID = {hal-03030289},
HAL_VERSION = {v1},
}