@inproceedings{desagazan:hal-03003564,
TITLE = {Investigation on icp-cvd as a polyvalent low cost technology dedicated to low temperature $\mu$-si tft prototyping.},
AUTHOR = {de Sagazan, O. and Uvarov, A. and Bestelink, E. and Sporea, R A and Jacques, Emmanuel},
URL = {https://hal.science/hal-03003564},
BOOK
TITLE = {57th SID International Symposium, Seminar and Exhibition, Display Week, 2020},
ADDRESS = {San Jose, United States},
EDITOR = {Donelan J.},
PUBLISHER = {Blackwell Publishing Ltd},
SERIES = {Digest of Technical Papers - SID International Symposium},
VOLUME = {51},
NUMBER = {1},
PAGES = {1538-1541},
YEAR = {2020},
MONTH = Aug, DOI = {10.1002/sdtp.14182},
KEYWORDS = {Flexible electronics ; ICP-CVD ; Low temperature electronics ; PECVD ; TFT fabrication ; $\mu$-Si doped},
HAL_ID = {hal-03003564},
HAL_VERSION = {v1},
}