@inproceedings{kervran:hal-01484551,
TITLE = {Silicon: A flexible material for bendable electronics and sensors},
AUTHOR = {Kervran, Y. and Kandoussi, K. and Dong, H. and Janfaoui, S. and Coulon, N. and Simon, C. and Jacques, E. and Mohammed-Brahim, T.},
URL = {https://univ-rennes.hal.science/hal-01484551},
BOOK
TITLE = {31st Symposium on Microelectronics Technology and Devices, SBMicro 2016},
ADDRESS = {Horizonte, Brazil},
PUBLISHER = {Institute of Electrical and Electronics Engineers Inc.},
YEAR = {2016},
MONTH = Aug, DOI = {10.1109/SBMicro.2016.7731313},
KEYWORDS = {Deformation ; Flexible electronics ; Microelectronics ; Silicon ; Students ; Temperature ; Thin film transistors ; Commercial applications ; Flexible materials ; Flexible plastics ; Maximum temperature ; Mechanical performance ; Mechanical reliability ; Microcrystalline silicon thin films ; Reproducibilities ; Microcrystalline silicon},
HAL_ID = {hal-01484551},
HAL_VERSION = {v1},
}