@inproceedings{pes:hal-01328020,
TITLE = {Enhancement of VCSEL performances using a novel bonding process based on localized electroplating copper through Silicon vias},
AUTHOR = {Pes, Salvatore and Taleb, Fethallah and Paranthoen, Cyril and Levallois, Christophe and Chevalier, Nicolas and de Sagazan, Olivier and Folliot, Herv{\'e} and Alouini, Mehdi},
URL = {https://hal.science/hal-01328020},
BOOK
TITLE = {9th European Workshop on VCSELs (VCSEL Day 2016)},
ADDRESS = {Darmstadt, Germany},
ORGANIZATION = {TU Darmstadt},
YEAR = {2016},
MONTH = Jun, KEYWORDS = {thermal management ; VCSEL ; TSHEC ; optoelectronics ; cleanroom process ; fabrication ; wafer bonding},
HAL_ID = {hal-01328020},
HAL_VERSION = {v1},
}