@misc{taleb:hal-01112963,
TITLE = {Substrate bonding using electroplated copper through silicon vias for VCSEL fabrication},
AUTHOR = {Taleb, Fethallah and Levallois, Christophe and Paranthoen, Cyril and Chevalier, Nicolas and de Sagazan, Olivier and Letoublon, Antoine and Durand, Olivier},
URL = {https://hal.science/hal-01112963},
NOTE = {Poster - ISBN: 978-1-4799-5729-3},
HOWPUBLISHED = {26th International Conference on Indium Phosphide and Related Materials (IPRM 2014)},
PUBLISHER = {IEEE},
PAGES = {P21},
YEAR = {2014},
MONTH = May, DOI = {10.1109/ICIPRM.2014.6880543},
KEYWORDS = {VCSEL ; Bonding ; Silicon Photonics},
PDF = {https://hal.science/hal-01112963/file/Taleb-IPRM%202014.pdf},
HAL_ID = {hal-01112963},
HAL_VERSION = {v1},
}